Title:
RESIN FILM, METALLIZED FILM FOR CAPACITOR, AND CAPACITOR
Document Type and Number:
Japanese Patent JP2021063192
Kind Code:
A
Abstract:
To provide a resin film which has high dielectric breakdown strength under a high temperature, has thin thickness, and has excellent winding suitability without using an anti-blocking agent.SOLUTION: A resin film has at least a layer containing 45-99.5 pts.mass of a thermoplastic resin containing a sulfonyl group in a main chain and 0.5-55 pts.mass of a polycarbonate-based resin, and has thickness of 15 μm or less.
Inventors:
MATSUI TAKUMI
IKEDA KAZUO
KAKEHI AKIHIRO
IKEDA KAZUO
KAKEHI AKIHIRO
Application Number:
JP2019189537A
Publication Date:
April 22, 2021
Filing Date:
October 16, 2019
Export Citation:
Assignee:
OJI HOLDINGS CORP
International Classes:
C08J5/18; C08L69/00; C08L81/06; H01G4/32
Attorney, Agent or Firm:
Junya Tanaka
Mizuya Kamiya
Mizuya Kamiya