Title:
ADHESIVE COMPOSITION FOR CONDUCTIVE SHEET AND USE THEREFOR
Document Type and Number:
Japanese Patent JP2021070770
Kind Code:
A
Abstract:
To provide an adhesive composition for a conductive sheet whereby it is possible to bond between a conductive sheet for wearable products and an adherend and also bond between layers of conductive sheets for wearable products with high strength, and it is possible to ensure high flexibility and elasticity of bonding places.SOLUTION: An adhesive composition contains an acrylic adhesive polymer (A) predominantly composed of an acrylic polymer chain having a constitutional unit derived from a (meth)acrylic monomer, where, the acrylic polymer chain has a glass transition temperature of -80°C or higher and 10°C or lower, and an adhesive layer formed using the adhesive composition has a storage elastic modulus of 1.0 MPa or less at 23°C.SELECTED DRAWING: None
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Inventors:
TAKEYA NOBUYUKI
NAKAMURA KENICHI
HASHIMOTO YUSUKE
NAKAMURA KENICHI
HASHIMOTO YUSUKE
Application Number:
JP2019199329A
Publication Date:
May 06, 2021
Filing Date:
October 31, 2019
Export Citation:
Assignee:
TOAGOSEI CO LTD
International Classes:
C09J133/00; B32B27/00; B32B27/30; C09J7/38; C09J133/04; C09J153/00; H01B5/02
Domestic Patent References:
| JP2019108498A | 2019-07-04 | |||
| JP2018524425A | 2018-08-30 | |||
| JP2019011382A | 2019-01-24 | |||
| JP2010200200A | 2010-09-09 | |||
| JP2014208762A | 2014-11-06 | |||
| JP5924324B2 | 2016-05-25 |
Attorney, Agent or Firm:
Tsuyoshi Yamada
Kyoko Hino
Kyoko Hino