Title:
CURABLE COMPOSITION AND SEMICONDUCTOR DEVICE USING THE COMPOSITION AS SEALING AGENT
Document Type and Number:
Japanese Patent JP2021080349
Kind Code:
A
Abstract:
To provide a curable composition for improving energization reliability, and a semiconductor device using the curable resin composition as a sealing agent.SOLUTION: A curable composition contains (A) a polyhedron structure polysiloxane modification body, (B) a compound which contains no siloxane structure of a T unit and has two or more alkenyl groups in one molecule, (C) a compound which has three or more hydrosilyl groups and/or alkenyl groups in one molecule, is represented by general formula (1) and includes a T unit structure, and (D) a hydrosilylation catalyst. A content of the component (C) is 10 wt.% or more and 70 wt.% or less when the total weight of the component (A), the component (B) and the component (C) is 100 wt.%.SELECTED DRAWING: None
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Inventors:
ISHIGURO FUMIYASU
Application Number:
JP2019208073A
Publication Date:
May 27, 2021
Filing Date:
November 18, 2019
Export Citation:
Assignee:
KANEKA CORP
International Classes:
C08L83/05; C08L83/07; H01L23/29; H01L23/31