Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2021086988
Kind Code:
A
Abstract:
To provide a technique capable of suppressing adhesion of particles to a substrate.SOLUTION: A substrate processing apparatus comprises: a holding part for horizontally holding a substrate; a substrate rotation part for rotating the substrate together with the holding part around a vertical axis; a nozzle that supplies a liquid to an upper surface of the substrate held by the holding part; a supply part for supplying the liquid to the nozzle; and a moving part for moving the nozzle in a radial direction of the substrate. The nozzle includes: a first nozzle part for discharging the liquid; and a second nozzle part for discharging the liquid in a direction different from the first nozzle part. A ray of the first nozzle part and a ray of the second nozzle part cross at a cross point. The supply part includes: a first flow rate controller that adjusts a discharge amount of the first nozzle part; and a second flow rate controller that adjusts a discharge amount of the second nozzle part independently of the discharge amount of the first nozzle part.SELECTED DRAWING: Figure 1
Inventors:
LEE SUGUEN
Application Number:
JP2019217116A
Publication Date:
June 03, 2021
Filing Date:
November 29, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/304
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito