Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2021150348
Kind Code:
A
Abstract:
To provide a structure of a semiconductor device and a hermetical sealing method with fewer defects in a PIND test.SOLUTION: A method includes: providing a package body 10a including a first recess 18 and a first solder outflow prevention part 26a, each provided on the first sealing surface 16a; providing a cap 92 having a second sealing surface 16b facing the first sealing surface 16a; placing a ball solder 60 in the first recess 18; placing the cap 92 on the ball solder 60; and as a hermetical sealing step, melting once and then solidifying the ball solder 60 to bond the first sealing surface 16a and the second sealing surface 16b to each other.SELECTED DRAWING: Figure 7
Inventors:
TSUJI SEIICHI
Application Number:
JP2020045930A
Publication Date:
September 27, 2021
Filing Date:
March 17, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/02; B23K1/00
Attorney, Agent or Firm:
Kanako Murakami
Shigeaki Matsui
Kuratani Yasutaka
Shigeaki Matsui
Kuratani Yasutaka