Title:
ENCAPSULATING RESIN COMPOSITION AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2021155474
Kind Code:
A
Abstract:
To provide an encapsulating resin composition which suppresses occurrence of warping of an encapsulated body.SOLUTION: Provided is an encapsulating resin composition comprising an epoxy resin, a curing agent, and thermal expansion filler with a core-shell structure, where the thermal expansion filler contains a volatile expansion agent inside a shell in the core-shell structure and, in a disk-like cured material having a diameter of 100 mm and a thickness of 3 mm, obtained by molding the encapsulating resin composition under conditions of a mold temperature of 175°C, a molding pressure of 14 MPa, and a cure time of 120 seconds, a shrinkage factor calculated by the following formula (1) is 0.005 to 0.14%. Shrinkage factor(%)={(inner diameter size of mold cavity at 175°C)-(outer diameter size of the disk-like cured material at 25°C)}/(inner diameter size of mold cavity at 175°C)×100(%) (1)SELECTED DRAWING: Figure 1
More Like This:
Inventors:
YAMASHITA KOHEI
Application Number:
JP2020054000A
Publication Date:
October 07, 2021
Filing Date:
March 25, 2020
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L63/00; C08K3/013; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Shinji Hayami