Title:
EPOXY RESIN COMPOSITION AND CURED MATERIAL
Document Type and Number:
Japanese Patent JP2021155484
Kind Code:
A
Abstract:
To provide an epoxy resin composition which can afford a cured material having excellent moldability, high thermal conductivity when composited with inorganic filler, a low thermal expansion property, and excellent heat resistance and moisture resistance.SOLUTION: Provided is an epoxy resin composition comprising (A) an epoxy resin and (B) a curing agent, where 50 wt% or more of the epoxy resin is made up of a 4,4'-benzophenone-based epoxy resin, 50 wt% or more of the curing agent is made up of bifunctional phenols and aromatic diamines where the bifunctional phenols and the aromatic diamines respectively are set to 20 to 80 wt% and 80 to 20 wt% of the curing agent, and an equivalent ratio of epoxy groups in the epoxy resin and functional groups in the curing agent is set to a range of 0.8 to 1.5. This epoxy resin composition may contain 30 to 95 wt% of inorganic filler and is suitable for an electronic material and a composite material.SELECTED DRAWING: None
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Inventors:
KAJI MASASHI
OGAMI KOICHIRO
OGAMI KOICHIRO
Application Number:
JP2020054246A
Publication Date:
October 07, 2021
Filing Date:
March 25, 2020
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD
International Classes:
C08G59/40; C08G59/22; C08J5/24
Attorney, Agent or Firm:
Kazuya Sasaki
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Katsuo Naruse
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Katsuo Naruse