Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2021170597
Kind Code:
A
Abstract:
To perform impedance matching for each of receive and transmit paths, even when the receive and transmit paths for data signals are combined.SOLUTION: A semiconductor device according to one embodiment has an electrode pad PD, a receiving circuit RC1 that receives an input signal via the electrode pad PD, a transmitting circuit TC1 that transmits an output signal via the electrode pad PD, a coil L1 connected between the electrode pad PD and the receiving circuit RC1, a coil L2 connected between the coil L1 and the receiving circuit RC1, and a coil L3 connected between the coil L1 and the transmitter circuit TC1. The coil L3 and parasitic capacitance PCe are connected between coil L1 and coil L2.SELECTED DRAWING: Figure 2
Inventors:
UCHIDA SHINICHI
Application Number:
JP2020073191A
Publication Date:
October 28, 2021
Filing Date:
April 16, 2020
Export Citation:
Assignee:
RENESAS ELECTRONICS CORP
International Classes:
H01L21/822; H01L27/04
Attorney, Agent or Firm:
Tsutsui International Patent Office