Title:
【考案の名称】積層チップ部品
Document Type and Number:
Japanese Patent JP2604139
Kind Code:
Y2
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Inventors:
Osamu Shibaki
Application Number:
JP1820793U
Publication Date:
April 17, 2000
Filing Date:
March 18, 1993
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H01F27/00; H01F17/00; H01G4/30; H01G4/40; H03H7/075; (IPC1-7): H01F17/00; H01F27/00; H01G4/30; H01G4/40; H03H7/075
Domestic Patent References:
| JP1192107A | ||||
| JP3225905A | ||||
| JP4158614A | ||||
| JP523513U |
Attorney, Agent or Firm:
Masahiko Maruoka