Title:
【発明の名称】半導体封止用樹脂組成物及び半導体装置
Document Type and Number:
Japanese Patent JP2864415
Kind Code:
B2
Inventors:
INO SHIGEKI
SHIOBARA TOSHIO
FUTATSUMORI KOJI
ASANO HIDEKAZU
SHIOBARA TOSHIO
FUTATSUMORI KOJI
ASANO HIDEKAZU
Application Number:
JP28741393A
Publication Date:
March 03, 1999
Filing Date:
October 22, 1993
Export Citation:
Assignee:
SHINETSU KAGAKU KOGYO KK
International Classes:
C08K3/08; C08K3/00; C08K3/36; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08K3/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP418445A | ||||
| JP63128020A | ||||
| JP366744A | ||||
| JP6329879A |
Attorney, Agent or Firm:
Takashi Kojima