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Title:
表示装置及びその製造方法
Document Type and Number:
Japanese Patent JP3571694
Kind Code:
B2
Abstract:
An adhesion-suppressing agent is added or applied to a picture element assembly precursor which is a precursor of a picture element assembly. Accordingly, when the hardening is performed while allowing the picture element assembly precursor to make pressed contact with an optical waveguide plate, the picture element assembly precursor is prevented from adhesion to the optical waveguide plate. Further, the gap between the picture element assembly and the optical waveguide plate is narrowed by allowing the adhesion-suppressing agent to intervene. Therefore, when a display device is in the light emission state, the picture element assembly reliably makes pressed contact with the optical waveguide plate. Further, owing to the adhesion-suppressing agent, the mutual adhesion between the picture element assembly and the optical waveguide plate is remarkably suppressed when the display device is used. Preferred examples of the adhesion-suppressing agent include silicone-based substances.

Inventors:
Yukihisa Takeuchi
Tsutomu Nanataki
Natsumi Shimokawa
Takayoshi Akao
Kazuhiro Yamamoto
Application Number:
JP2001549129A
Publication Date:
September 29, 2004
Filing Date:
December 26, 2000
Export Citation:
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Assignee:
Nippon Insulator Co., Ltd.
International Classes:
G02B26/02; (IPC1-7): G02B26/08; B81B3/00; B81C1/00
Domestic Patent References:
JP10078549A
JP2000075223A
JP7287176A
Foreign References:
WO1999024859A1
Attorney, Agent or Firm:
Takehiro Chiba
Tatsuhiko Sato



 
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