Title:
張り合わせウェーハおよびその製造方法
Document Type and Number:
Japanese Patent JP3611143
Kind Code:
B2
Inventors:
Etsuro Morita
Chizuko Okada
Chizuko Okada
Application Number:
JP24547395A
Publication Date:
January 19, 2005
Filing Date:
August 29, 1995
Export Citation:
Assignee:
Mitsubishi Sumitomo Silicon Co., Ltd.
International Classes:
H01L21/02; H01L27/12; (IPC1-7): H01L21/02
Domestic Patent References:
| JP7161596A | ||||
| JP4199632A |
Attorney, Agent or Firm:
Ichiro Abe