Title:
セラミック多層基板の製造方法および未焼成の複合積層体
Document Type and Number:
Japanese Patent JP3716832
Kind Code:
B2
Abstract:
A method of producing a ceramic multilayer substrate comprising the steps of: as a first step, producing a green composite laminate 11 containing first and second shrink-suppressing layers formed on one main surface 13 and the other main surface 14 of a green multilayer mother substrate 12 comprising a plurality of ceramic green layers 17 containing ceramic powder, the first and second shrink-suppressing layers containing a sintering-difficult powder substantially incapable of being sintered under the sintering conditions for the ceramic powder; as a second step, forming first grooves 16 extending from the first shrink-suppressing layer 13 side so as to pass through the first shrink-suppressing layer 13 and reach a part of the multilayer mother substrate 12; as a third step, firing the composite laminate 11; as a fourth step, removing the first and second shrink-suppressing layers 13 and 14 and taking out the sintered multilayer mother substrate 11; and as a fourth step, dividing the multilayer mother substrate 12 along the grooves 16, and taking out a plurality of the ceramic multilayer substrates. Thereby, the shrink in the plan direction at firing can be suppressed. Thus, a ceramic multilayer substrate having a high dimensional accuracy and a high reliability can be produced with a high production efficiency.
Inventors:
Yoshifumi Saito
Hironori Kawakami
Hironori Kawakami
Application Number:
JP2002545042A
Publication Date:
November 16, 2005
Filing Date:
November 22, 2001
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
B28B11/24; B28B17/00; B32B18/00; C04B35/638; H01L21/48; H01L23/15; B32B37/00; H05K1/03; H05K3/00; H05K3/46; (IPC1-7): H05K3/46; B28B11/14; H05K1/02
Domestic Patent References:
| JP799263A | ||||
| JP2000315841A | ||||
| JP786743A |