Title:
粘着チャック装置
Document Type and Number:
Japanese Patent JP3882004
Kind Code:
B2
Abstract:
A board is surely mounted and removed by a simple structure. On a board side of a holding plate (1), an adhesive member (3) for adhering and holding a board (A) by facing a rear plane (A1) of the board, and a deforming film (4) which can deform by protruding and receding in a direction crossing a plane (1a) on the board side are provided. An adhesive surface (3a) of the adhesive member (3) and the board (A) are abutted and adhered by the protruding and receding deformation of the deforming film (4), and the board (A) is peeled from the adhesive surface (3a) of the adhesive member (3) without difficulty by forcibly separating the both.
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Inventors:
Yoshikazu Otani
Michiya Yokota
Michiya Yokota
Application Number:
JP2006515325A
Publication Date:
February 14, 2007
Filing Date:
April 08, 2005
Export Citation:
Assignee:
Shin-Etsu Engineering Co., Ltd.
International Classes:
G02F1/13; B65G49/06; H01J11/20; H01J11/44; H01L21/683; G02F1/1333
Domestic Patent References:
JP6265916A | ||||
JP1142532A | ||||
JP10240148A | ||||
JP2001133745A | ||||
JP2003241160A | ||||
JP2003273508A |
Attorney, Agent or Firm:
Sadayuki Hosoi
Ishiwatari Eibo
Ishiwatari Eibo
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