Title:
マトリックス樹脂組成物
Document Type and Number:
Japanese Patent JP3985224
Kind Code:
B2
Abstract:
An epoxy composition includes an epoxy resin, a latent amine curing agent and a specific catalyst. Preferably, the epoxy resin includes two epoxide groups per molecule, and the latent amine curing agent is a dicyanopolyamide, most preferably, dicyandiamide. The specific catalyst is 2,4-toluene bis dimethyl urea. A prepreg employing the epoxy composition of the present invention can achieve a 95% cure in about one half of the time required by a prepreg that differs only in the catalyst employed. Furthermore, prepregs employing the epoxy composition of the present invention have glass transition temperatures higher than the curing temperatures when cured at a temperature range from about 80 DEG C to about 150 DEG C, enabling cured prepregs to be removed from molds without being cooled.
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Inventors:
Way (Helen) Lee
Teruo Miwa
Teruo Miwa
Application Number:
JP2002204882A
Publication Date:
October 03, 2007
Filing Date:
July 12, 2002
Export Citation:
Assignee:
Torre Composits (USA), Inc.
International Classes:
C08G59/20; C08G59/40; C08J5/24; C08G59/68; C08K7/02; C08L63/00; C08L63/02; C08L101/00; C09J7/02; C09J163/00; C09J163/02; C09J201/00
Domestic Patent References:
| JP9316171A | ||||
| JP2001049013A | ||||
| JP11171976A |
Attorney, Agent or Firm:
Tomonori Iwami