Title:
面発光型半導体発光素子
Document Type and Number:
Japanese Patent JP4050028
Kind Code:
B2
Abstract:
A semiconductor surface light-emitting device comprises, in a multi-layered structure formed on a substrate, a light-emitting part surrounded by a groove or grooves, provided with an active layer, a vertical cavity and a current aperture, a peripheral part external to the grooves, and a connecting portion connecting the light-emitting part with the peripheral part. There is provided an empty space or a high-resistance region on the upper part of this multi-layered connecting portion, which includes at least the current aperture formed layer or the active layer. This configuration effectively eliminates a path for a leakage current flowing into the peripheral part from the light-emitting part.
Inventors:
Ezaki Ruisen
Keiji Takaoka
Keiji Takaoka
Application Number:
JP2001302640A
Publication Date:
February 20, 2008
Filing Date:
September 28, 2001
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01S5/183; H01S5/187; H01S5/20; H01S5/343; H01S5/042
Domestic Patent References:
| JP2000012962A | ||||
| JP10229248A | ||||
| JP3101561U |
Foreign References:
| WO1998039824A1 |
Attorney, Agent or Firm:
Takehana Kikuo
Hiroshi Uji
Hiroshi Uji