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Patent Searching and Data


Title:
セラミック素子の製造方法
Document Type and Number:
Japanese Patent JP4153339
Kind Code:
B2
Abstract:

To provide a process for producing a ceramic element in which electrical connection is made surely between one and the other end face sides of a ceramic layer through a through hole.

A conductive pattern covering one end side of a through hole is formed by printing conductive paste on a green sheet 34 using a screen printer 39. Subsequently, the green sheet 34 is heated at a temperature lower than the drying temperature of the conductive paste using a heating furnace 51. Since the conductive paste is softened, it can be spread in the through hole. Thereafter, the green sheet 34 is heated at the drying temperature using a drying furnace 52. Since the conductive paste is dried/solidified, a conductive member continuous from one end to the other end of the through hole can be formed surely in the through hole.

COPYRIGHT: (C)2005,JPO&NCIPI


Inventors:
Seishi Sasaki
Kudo Minami
Kazushi Tatemoto
Application Number:
JP2003083532A
Publication Date:
September 24, 2008
Filing Date:
March 25, 2003
Export Citation:
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Assignee:
tdk Corporation
International Classes:
H01L41/083; H01L41/22; H01L41/29
Domestic Patent References:
JP2001091532A
JP2001307943A
JP2001155948A
JP9300331A
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Toyotaka Abe