Title:
モールドフレームとこれを有するバックライトアセンブリ及び液晶表示装置
Document Type and Number:
Japanese Patent JP4287197
Kind Code:
B2
Abstract:
A mold frame receiving wires for supplying electric power to lamps in the mold frame, a backlight assembly having the mold frame and a liquid crystal display apparatus having the mold frame are presented. A mold frame installed in a direct illumination type backlight assembly has a first sidewall having first receiving spaces for respectively receiving first lamp sockets and at least one first return wire received in the first receiving spaces to be electrically connected to the first lamp sockets. The first return wire extends along the sidewalls of the mold frame. Accordingly, the mold frame may be reduced since the return wires are received and the lamp sockets are installed in the mold frame.
Inventors:
Shin Makoto
Application Number:
JP2003144667A
Publication Date:
July 01, 2009
Filing Date:
May 22, 2003
Export Citation:
Assignee:
Samsung Electronics Company Limited
International Classes:
F21V23/00; F21S2/00; F21S8/04; F21V19/00; G02F1/13357; F21Y103/00
Domestic Patent References:
| JP6301034A | ||||
| JP10333126A | ||||
| JP2002008408A | ||||
| JP2002324425A | ||||
| JP2001249622A |
Attorney, Agent or Firm:
Takahashi Hayashi & Partners