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Title:
固体撮像装置
Document Type and Number:
Japanese Patent JP4337549
Kind Code:
B2
Abstract:
A semiconductor chip (1) is connected to power sources of different power source voltage values. The power source terminals (45-50) supply the digital power source and ground voltages (DVDD1-DVDD3 and DVSS1-DVSS3), from a power source system, respectively. The power source terminals (40-43) supply the analog power source and ground voltages (AVDD1,AVDD2 and AVSS1,AVSS2) from another power source system, respectively.

Inventors:
Nobuo Nakamura
Tomoyuki Umeda
Keiji Mabuchi
Hiroaki Fujita
Takashi Abe
Eiichi Funatsu
Hiroki Sato
Application Number:
JP2003583019A
Publication Date:
September 30, 2009
Filing Date:
April 04, 2003
Export Citation:
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Assignee:
ソニー株式会社
International Classes:
H01L27/146; H04N5/335; H04N5/355; H04N5/374
Domestic Patent References:
JP2000224495A
JP2000209508A
JP2002507346A
JP2001077684A
Attorney, Agent or Firm:
Takahisa Sato



 
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