Title:
固体撮像素子及びその製造方法
Document Type and Number:
Japanese Patent JP4363136
Kind Code:
B2
Abstract:
To provide a solid state imaging element which assures excellent sensitivity and optical characteristics and electrical characteristics.
The solid state imaging element is constituted by forming an element isolating layer 17 embedded in the groove formed in a semiconductor substrate 16, forming a conductive material layer 26 embedded within this element isolating layer 17, and utilizing such conductive material layer 26 as wiring.
COPYRIGHT: (C)2005,JPO&NCIPI
Inventors:
Hiromi Suzuki
Application Number:
JP2003322041A
Publication Date:
November 11, 2009
Filing Date:
September 12, 2003
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L27/146; H01L21/3205; H01L21/76; H01L23/52; H04N5/335; H04N5/369; H04N5/374
Domestic Patent References:
| JP61133660A | ||||
| JP61117863A | ||||
| JP6205158A | ||||
| JP2194645A | ||||
| JP61222258A | ||||
| JP2002110990A |
Attorney, Agent or Firm:
Yoshitsuno Kakuda
Hironobu Isoyama
Hironobu Isoyama
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