基板の形状を調整するチャック・システムと方法

Japanese Patent JP4391420

B2

A chucking system to hold a substrate, said chucking system comprising: a chuck body (42) having first and second opposed sides (46, 48) with an edge surface (50) extending therebetween, said first side (46) including first and second spaced-apart recesses (52, 54) defining first and second spaced-apart support regions (58, 60), with said first support region (58) cincturing said second support region (60) and said first and second recesses (52, 54), and said second support region (60) cincturing said second recess (54), with a portion (62) of said chuck body (42) in superimposition with said second recess (54) being transparent to actinic radiation having a predetermined wavelength, said portion extending from said second side (48) and terminating proximate to said second recess (54), said second side and said edge surface defining exterior surfaces, with said chuck body (42) including a throughway (64, 66) extending through said chuck body placing one of said first and second recesses (52, 54) in fluid communication with one of said exterior surfaces.

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Choi, Byung-jin
Ronald Di, Boysin
Sligny Vassan, Citrgata Vui
Watts, Michael Pii Shii
Babs, Daniel A
Mario Jay, Meissle
Bailey, Hillman El
Shoemaker, Norman E

JP2004552099A

December 24, 2009

November 12, 2003

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Molecular Imprints Incorporated

H01L21/683; B81C1/00; B81C99/00; B82B3/00; G03B27/62; G03F7/00; G03F7/20; H01L21/027

JP2002141392A
JP6040560A
JP7178691A
JP4186818A
JP5009886U
JP2000340510A
JP2002270677A
JP11111819A
JP2000237982A

Masaki Yamakawa
Shigeki Yamakawa

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