Title:
カメラモジュールソケット
Document Type and Number:
Japanese Patent JP4477660
Kind Code:
B2
Abstract:
To provide a camera module socket to improve grounding to electronic equipment.
The camera module socket 1 is built in electronic equipment E and inserted into a through hole TH provided beforehand in an electronic circuit board PWB and connected and fixed to the electronic circuit board PWB. At least the bottom part 13c of the camera module socket 1 is formed of a good conductor metal plate and a part of the metal plate is cut out and raised outward to form a case shield part 13b having a spring force, and the case shield part 13b can contact by the spring force the inner face E1 of the case of the electronic equipment E in the electronic equipment E.
COPYRIGHT: (C)2009,JPO&INPIT
More Like This:
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JP4222616 | Connection device |
Inventors:
Kiyoshi Asai
Junichi Kobayashi
Shuichi Urume
Daisuke Okitsu
Junichi Kobayashi
Shuichi Urume
Daisuke Okitsu
Application Number:
JP2007213814A
Publication Date:
June 09, 2010
Filing Date:
August 20, 2007
Export Citation:
Assignee:
SMK Corporation
International Classes:
H01R33/76; H01R4/64; H01R13/652; H04N5/225
Domestic Patent References:
JP2006140111A | ||||
JP2005276626A | ||||
JP2001006818A | ||||
JP2001076826A | ||||
JP1158678U | ||||
JP2005101020A |
Attorney, Agent or Firm:
Masayoshi Yasuhara