Title:
積層セラミック電子部品の製造方法
Document Type and Number:
Japanese Patent JP4556337
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an external electrode capable of resisting tensile stress by heating a conductive resin paste. SOLUTION: A first layer electrode is formed from the Cu conductive paste which is to be adhered on both the terminal parts of a ceramic element body, a second layer electrode is formed from conductive paste, to which glass frits are added, containing a noble metal with Ag and Cu to be adhered on the first layer electrode as the main component, and afterwards annealing treatment is carried out at a heating temperature of from 300 to 600 deg.C.
Inventors:
Akitoshi Yoshii
Hideki Yokoyama
Masayuki Okabe
Yoshinori Fujikawa
Miki Goto
Hideki Yokoyama
Masayuki Okabe
Yoshinori Fujikawa
Miki Goto
Application Number:
JP2001082543A
Publication Date:
October 06, 2010
Filing Date:
March 22, 2001
Export Citation:
Assignee:
tdk Corporation
International Classes:
H01G4/12; H01G4/30
Domestic Patent References:
| JP2000286144A | ||||
| JP61012016A |
Attorney, Agent or Firm:
Hitoshi Maeda
Toru Suzuki
Toru Suzuki