Title:
被処理体の載置装置
Document Type and Number:
Japanese Patent JP4592916
Kind Code:
B2
Abstract:
A plasma etching apparatus includes a worktable disposed in a hermetic process chamber. The worktable has a main surface for placing a wafer thereon, and a sub-surface for placing a focus ring thereon. A cooling mechanism for supplying cold to the main surface and sub-surface is disposed in the worktable. A heat transfer medium made of conductive silicone rubber is interposed between the sub-surface and focus ring. A press mechanism presses the focus ring toward the sub-surface. The heat transfer medium improves thermal conductivity between the sub-surface and focus ring to be higher than in a case with no thermal transfer medium.
Inventors:
Toshifumi Nagaiwa
Hidee Sekizawa
Imafuku Kosuke
Atsushi Oyabu
Hidee Sekizawa
Imafuku Kosuke
Atsushi Oyabu
Application Number:
JP2000323208A
Publication Date:
December 08, 2010
Filing Date:
October 23, 2000
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
C23F4/00; H01L21/683; C23C16/458; H01J37/32; H01L21/00; H01L21/302; H01L21/3065
Domestic Patent References:
| JP10303288A | ||||
| JP8293539A | ||||
| JP11340149A | ||||
| JP9275101A | ||||
| JP2000036490A |
Attorney, Agent or Firm:
Hajime Ohara