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Title:
半導体集積回路のレイアウト設計方法
Document Type and Number:
Japanese Patent JP4628709
Kind Code:
B2
Abstract:

To solve the problem wherein the deviations in the consumption-current distribution, when a consumption current is increased partially on a semiconductor integrated circuit, has not been taken into consideration by layout designing methods.

In the layout designing method for a semiconductor integrated circuit, a power connecting cell electrically connecting an uppermost-layer wiring and a lower-layer wiring is arranged. The layout designing method has a process, in which the arrangement of a plurality of functional blocks on the semiconductor integrated circuit is set, and the process in which a plurality of the power-connecting cells are disposed in a semiconductor integrated-circuit forming region on the outsides of functional-block arranging regions. The layout designing method further has a process, in which the effect of the voltage drop of the uppermost-layer wiring is analyzed on the basis of the disposal of the power connecting cells.

COPYRIGHT: (C)2006,JPO&NCIPI


Inventors:
Nobuya Okada
Application Number:
JP2004200268A
Publication Date:
February 09, 2011
Filing Date:
July 07, 2004
Export Citation:
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Assignee:
Renesas Electronics Corporation
International Classes:
H01L21/82; G06F17/50
Domestic Patent References:
JP2000068383A
JP2004158532A
JP2003017568A
JP4330716A
Attorney, Agent or Firm:
Ken Ieiri



 
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