Title:
一つ又はそれ以上の処理流体を用いた、半導体ウエハー又は他のマイクロエレクトロニクス用の基板に使用されるツール用の移動かつ入れ子化できる、コンパクトなダクトシステム
Document Type and Number:
Japanese Patent JP4692785
Kind Code:
B2
Abstract:
Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.
Inventors:
Rose Allandy.
Kardarian Dee.
Eppes James M.
Hanson Stephanie.
Kardarian Dee.
Eppes James M.
Hanson Stephanie.
Application Number:
JP2008504102A
Publication Date:
June 01, 2011
Filing Date:
March 15, 2006
Export Citation:
Assignee:
FSI International Inc.
International Classes:
H01L21/02; H01L21/683
Domestic Patent References:
| JP2004265912A | ||||
| JP2004153078A | ||||
| JP2004031400A | ||||
| JP2001267278A | ||||
| JP2001160546A |
Attorney, Agent or Firm:
Calyx
Miyazaki Yoshio
Kaoru Onozuka
Akio Tagami
High Masahiro
Toshio Nakamura
Miyazaki Yoshio
Kaoru Onozuka
Akio Tagami
High Masahiro
Toshio Nakamura