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Title:
高分子材料の温度制御装置
Document Type and Number:
Japanese Patent JP4749810
Kind Code:
B2
Abstract:

To provide an apparatus for controlling the temperature of a polymeric material which molds the polymeric material by giving a definite pressure and a uniform shearing force to the polymeric material.

The apparatus for controlling the temperature of the polymeric material comprises a cylinder 13 connected to an extruder 11 and a mandrel 14 contained in the cylinder 13, rotating relatively to the cylinder 13 and having a concavoconvexo part formed on the outer surface with regard to a perpendicularly sectional plane in the axial direction wherein a gap 32 is formed in which the polymeric material 7 flows between the inner face of the cylinder 13 and the outer face of the mandrel 14, the gap 32 having thick regions and thin regions formed one after the other, and the concavoconvexo part having a form which is expressed by a predetermined spiral angle α that does not generate a impelling and an axially perpendicular forces in the axial direction.

COPYRIGHT: (C)2007,JPO&INPIT


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Inventors:
Satoshi Kasamatsu
Maniwa Hidetoshi
Application Number:
JP2005266812A
Publication Date:
August 17, 2011
Filing Date:
September 14, 2005
Export Citation:
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Assignee:
IKG Co., Ltd.
International Classes:
B29C48/92
Domestic Patent References:
JP54105158A
JP59187829A
JP2001501549A
JP53011354A
JP10016032A
JP7108585A
Attorney, Agent or Firm:
Yoshiyuki Kawaguchi
Tsutomu Toyama
Hidemi Matsukura
Yutaka Nagata