Title:
異質構造の製造方法
Document Type and Number:
Japanese Patent JP4800593
Kind Code:
B2
Abstract:
The production of a layer (25) of a first material on a substrate (22) of a second material, the two materials having different thermal dilation, comprises: (a) the selection of a first substrate of the first material and a second substrate of the second material, as well as a third substrate in a material identical to one of the two materials or made up of a material with a thermal dilation close to one of the materials; (b) the production of an assembly in which the first and second substrates are assembled against each other and the third substrate is assembled against one of the other two substrates; and (c) the production of a fracture of the first substrate within its thickness.
Inventors:
Martine Muriel
Busagor Alice
Busagor Alice
Application Number:
JP2004170674A
Publication Date:
October 26, 2011
Filing Date:
June 09, 2004
Export Citation:
Assignee:
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
International Classes:
H01L21/02; H01L21/762; H01L21/265; H01L27/12
Domestic Patent References:
| JP2003347522A | ||||
| JP10200079A | ||||
| JP7086106A | ||||
| JP1290229A |
Attorney, Agent or Firm:
Koichi Kamata
Shigeru Kuroda
Shigeru Kuroda