Title:
接続材料塗布装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4949114
Kind Code:
B2
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Inventors:
Takashi Otsuka
Application Number:
JP2007104263A
Publication Date:
June 06, 2012
Filing Date:
April 11, 2007
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H01L21/60; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2001223297A | ||||
| JP2005109416A | ||||
| JP2003273167A | ||||
| JP2000195897A |
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu
Horimai Kazuharu