Title:
ナノインプリント用樹脂製モールド
Document Type and Number:
Japanese Patent JP5292621
Kind Code:
B2
Abstract:
Disclosed is a resin mold for nanoimprinting, which has a resin layer having fine depressions and protrusions formed on the surface and is characterized in that the resin layer is formed from 1 to 49 parts by weight of a silicone-based macromonomer and/or a fluorine-based macromonomer and 99 to 51 parts by weight of at least one polymerizable monomer selected from the group consisting of a (meth) acrylic monomer, a styrene-based monomer, an epoxy-based monomer, an olefin-based monomer and a polycarbonate-based resin-forming monomer, the silicone-based macromonomer and/or the fluorine-based macromonomer has a molecular weight of 600 to 10000 and has, at an end of molecule, a reactive group copolymerizable with the polymerizable monomer, and when the reactive group is copolymerized with the polymerizable group, silicone-based units or fluorine-based units that constitute the macromonomer form side chains on a trunk polymer formed from the polymerizable monomer and the macromonomer.
Inventors:
Satoshi Uehara
Takeshi Misawa
Takeshi Misawa
Application Number:
JP2012527750A
Publication Date:
September 18, 2013
Filing Date:
August 03, 2011
Export Citation:
Assignee:
Soken Chemical Co., Ltd.
International Classes:
B29C59/02; B29C33/40; H01L21/027; B29K27/12; B29K83/00
Domestic Patent References:
| JPH04353407A | 1992-12-08 | |||
| JP2006198883A | 2006-08-03 | |||
| JP2006182011A | 2006-07-13 |
Foreign References:
| WO2008096594A1 | 2008-08-14 |
Attorney, Agent or Firm:
Patent corporation ssinpat