Title:
電子装置
Document Type and Number:
Japanese Patent JP5440440
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To realize an appropriate structure which reduces the size of an electronic equipment and secures an mounting area while radiating heat of a heating element by a heat sink in the electronic equipment which incorporates the heating element into a circuit board by providing the heating element in an internal layer of the multilayered circuit board.SOLUTION: An electronic equipment 1 includes a circuit board 10 formed by laminating multiple layers 11 and a heating element 20, which is provided at one of the internal layers 11 of the circuit board 10 and thereby is incorporated into the circuit board 10. In the electronic equipment 1, a heat sink 40, which radiates heat of the heating element 20, is disposed in a layer, out of the internal layers 11, which is located adjacent to the layer in which the heating element 20 is disposed. This structure allows the heat sink 40 to be incorporated into the circuit board 10 and be exposed at an end surface of the circuit board 10. The heat element 20 contacts with the heat sink 40 in the circuit board 10, and heat is radiated by the heat sink 40.
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Inventors:
Naoto Yoshitomi
Application Number:
JP2010177170A
Publication Date:
March 12, 2014
Filing Date:
August 06, 2010
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L23/36; H05K7/20
Domestic Patent References:
| JP2002270743A | ||||
| JP200943978A | ||||
| JP2008311397A | ||||
| JP2010157663A |
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office