Title:
半導体モジュール
Document Type and Number:
Japanese Patent JP5601373
Kind Code:
B2
Abstract:
A semiconductor module (1, 2, 3, 4, 5) which includes a semiconductor device (10); a wiring member (20, 22) that is connected to the semiconductor device; a cooling plate (50,501,502, 503,504) that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion (52,521,522,524a +524b) at an end thereof in a first direction (Y); and a molded portion (60) that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction (X) which is substantially perpendicular to the first direction (Y).
Inventors:
Doorway Takuya
Yoshikazu Suzuki
Masaya Kachi
Kiyofumi Nakajima
Tatsuya Miyoshi
Kawashima 崇功
Tomomi Okumura
Yoshikazu Suzuki
Masaya Kachi
Kiyofumi Nakajima
Tatsuya Miyoshi
Kawashima 崇功
Tomomi Okumura
Application Number:
JP2012531633A
Publication Date:
October 08, 2014
Filing Date:
September 02, 2010
Export Citation:
Assignee:
Toyota Motor Corp.
International Classes:
H01L23/36; H01L25/07; H01L25/18; H02M7/48; H05K7/20
Domestic Patent References:
| JP2009070934A | 2009-04-02 | |||
| JP2005191502A | 2005-07-14 | |||
| JP2008103502A | 2008-05-01 | |||
| JPH10294403A | 1998-11-04 | |||
| JP2008124430A | 2008-05-29 | |||
| JP2010177529A | 2010-08-12 | |||
| JP2003168769A | 2003-06-13 | |||
| JP2009070934A | 2009-04-02 | |||
| JP2005191502A | 2005-07-14 | |||
| JP2008103502A | 2008-05-01 | |||
| JPH10294403A | 1998-11-04 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito