Title:
導電性ペーストおよびその製造方法
Document Type and Number:
Japanese Patent JP5630363
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing a conductive paste that is advantageously used for forming an inside conductor film of a laminated ceramic electronic component, and can uniformly deposit, for instance, a ceramic powder for suppressing sintering which has an extremely small particle diameter of 100 nm or smaller, on a surface of a conductive metal powder without aggregating the ceramic powders.SOLUTION: The method for producing the conductive paste comprises the steps of: preparing the conductive metal powder, the ceramic powder, an organic solvent, an organic resin component and a dispersing agent; obtaining an organic vehicle containing the organic solvent and the organic resin component; producing a ceramic slurry by dispersing the ceramic powders in the organic solvent containing the dispersing agent, and adding one part of the organic vehicle to the organic solvent in which the ceramic powders are dispersed, to stabilize the dispersion state; producing a slurry of a metal powder in which the conductive metal powders are dispersed in the organic solvent containing the dispersing agent; and then mixing the ceramic slurry, the slurry of the metal powder and a balance of the organic vehicle.
Inventors:
大地 宏明
緒方 直明
谷光 力
緒方 直明
谷光 力
Application Number:
JP2011084190A
Publication Date:
November 26, 2014
Filing Date:
April 06, 2011
Export Citation:
Assignee:
株式会社村田製作所
International Classes:
H01B1/22; H01B1/00; H01B13/00; H01G4/232; H01G4/30
Attorney, Agent or Firm:
Masaaki Koshiba