Title:
インターポーザ用の金属張積層板とそれを用いた半導体パッケージ
Document Type and Number:
Japanese Patent JP5696302
Kind Code:
B2
Inventors:
Eiji Motobe
Koichi Nogami
Tatsuya Arisawa
Koichi Nogami
Tatsuya Arisawa
Application Number:
JP2009221476A
Publication Date:
April 08, 2015
Filing Date:
September 25, 2009
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H01L23/32; H01L23/14; H05K1/03
Domestic Patent References:
| JP2003147171A | ||||
| JP2004182850A | ||||
| JP2007059838A | ||||
| JP8216313A | ||||
| JP2005036242A | ||||
| JP2005162787A | ||||
| JP2004214271A |
Attorney, Agent or Firm:
Toshio Nishizawa