Title:
半導体装置の製造方法及び半導体製造装置
Document Type and Number:
Japanese Patent JP5738815
Kind Code:
B2
Inventors:
Hiroshi Tsujii
Application Number:
JP2012201132A
Publication Date:
June 24, 2015
Filing Date:
September 13, 2012
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L21/67; H01L21/683
Domestic Patent References:
| JP2008041985A | ||||
| JP2012195539A | ||||
| JP2013197511A | ||||
| JP2009065079A |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office