PURPOSE: Titled room temperature rapidly curing composition, comprising an epoxy resin, an amine curing agent and a dimethyl-aminomethylated polyalkenylphenol.

CONSTITUTION: An epoxy resin (A), MW200W1,000, is mixed with an amine curing agent (B), e.g., polymethylenediamine, so that the ratio, epoxy groups in component A/amino active hydrogens in component B, is 0.5W2.0. Then, 100pts. wt. total of components A and B is mixed with 0.1W30pts.wt. dimethylaminomethylated polyalkenylphenol, ≤10,000 number-average MW, in which the alkenylphenyl units are bonded to the dimethylaminomethyl units in a ratio of 1 to 0.5 or below.