Title:
袋詰電極の製造装置、および袋詰電極の製造方法
Document Type and Number:
Japanese Patent JP5820138
Kind Code:
B2
Abstract:
A device 100 for producing a packaged electrode 20 includes: a conveyance unit 200 configured to sequentially overlay the electrode 40 and the pair of separators 30 from a front end 51 side in a conveying direction while conveying the electrode 40 and the pair of separators 30; a first joining chip 302 configured to join lateral edges 31 of the pair of separators together; at least one second joining chip 303 positioned downstream of the first joining chip in the conveying direction and configured to join the lateral edges of the pair of separators together. Front ends of the lateral edges of the pair of separators being sequentially overlaid while being conveyed by the conveyance unit are joined together by the first joining chip positioned upstream before the front ends are conveyed to the second joining chip positioned downstream.
Inventors:
Hiroshi Yubara
Takehiro Yanagi
Kim Taiyuan
Manabu Yamashita
Takehiro Yanagi
Kim Taiyuan
Manabu Yamashita
Application Number:
JP2011085751A
Publication Date:
November 24, 2015
Filing Date:
April 07, 2011
Export Citation:
Assignee:
Kyoto Manufacturing Co., Ltd.
Nissan Motor Co., Ltd
Nissan Motor Co., Ltd
International Classes:
H01M10/04; H01M4/02; H01M50/466
Domestic Patent References:
| JP2007329112A | ||||
| JP5275073A | ||||
| JP53014261A | ||||
| JP59014261A | ||||
| JP3059948A | ||||
| JP62064056A | ||||
| JP2009123582A | ||||
| JP2007250319A |
Foreign References:
| US4337113 |
Attorney, Agent or Firm:
Hatta International Patent Corporation