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Title:
銅微粒子分散液の製造方法、銅微粒子の製造方法、銅微粒子分散液および銅微粒子
Document Type and Number:
Japanese Patent JP5848552
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a copper fine particle dispersion containing a copper fine particle having a fine particle diameter and excellent in sintering property at a low temperature.SOLUTION: A method for preparing a copper fine particle dispersion includes the steps of: adding an aliphatic monocarboxylic acid as a reducing agent and as a protecting agent, and a copper compound to a solvent to disperse the copper compound in the solvent in a solid state; and reducing the copper compound dispersed in the solvent to form a copper fine particle with a surface covered with the aliphatic monocarboxylic acid, thereby preparing the copper fine particle dispersion in which the copper fine particle is dispersed in the solvent.

Inventors:
Ishikawa Dai
Tomoya Abe
Hayashi Yamato
Hiroki Takizawa
Sekiguchi Kazuhiro
Application Number:
JP2011186200A
Publication Date:
January 27, 2016
Filing Date:
August 29, 2011
Export Citation:
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Assignee:
Hitachi Metals Co., Ltd.
Unisantis Electronics Singapore Pte Ltd.
International Classes:
B22F9/20; B22F1/00; B22F1/02; B22F9/00; B82Y30/00; B82Y40/00; H01B1/22; H01B5/00; H01B5/02; H01B13/00
Domestic Patent References:
JP6010014A
JP1259108A
JP2008198595A
JP2008150701A
JP2010153118A
JP2011032558A
JP1158081A
JP60258273A
JP2010189681A
Foreign References:
WO2010032841A1
WO2006019144A1
Attorney, Agent or Firm:
Masahiro Fukuoka
Seino
Toru Yui
Masahiro Fukuoka