Title:
成膜装置
Document Type and Number:
Japanese Patent JP5929429
Kind Code:
B2
Abstract:
A film-forming apparatus forms a film by sequentially supplying a plurality of kinds of reaction gases to a substrate placed between a placing unit and a ceiling plate in a processing chamber having vacuum atmosphere and supplying a replacement gas between supply of one reaction gas and supply of next reaction gas. A central gas ejecting unit is disposed above the central portion of the substrate, and includes gas ejecting ports formed therein to spread the gases toward the outer side in the horizontal direction. A peripheral gas supply unit is disposed to surround the central gas ejecting unit. The peripheral gas supply unit includes a plurality of gas ejecting ports, which is formed in the circumferential direction such that the gases are spread in the horizontal direction toward the outer circumferential side and the central side of the substrate in a plan view.
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Inventors:
Tetsuya Saito
Application Number:
JP2012081729A
Publication Date:
June 08, 2016
Filing Date:
March 30, 2012
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
C23C16/455
Domestic Patent References:
| JP2009224775A | ||||
| JP2008124424A | ||||
| JP2008251946A |
Attorney, Agent or Firm:
Toshio Inoue