Title:
キャリア付銅箔及びその製造方法、極薄銅層、銅張積層板の製造方法、並びにプリント配線板の製造方法
Document Type and Number:
Japanese Patent JP6396641
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a carrier-provided copper foil with improved thickness accuracy of an extremely thin copper layer on a copper foil carrier.SOLUTION: A carrier-provided copper foil comprises a copper foil carrier, a release layer laminated on the copper foil carrier and an extremely thin copper layer laminated on the release layer. For a 15 mm(MD direction)×150 mm(TD direction) sheet of the extremely thin copper layer, an average value and a standard deviation (σ) of measurements of the gravity thickness are measured by a gravity thickness method, and the weight thickness accuracy, determined by the equation, average of thickness accuracy(%)=3σ×100/gravity thickness measurements, is 6.15% or lower.
Inventors:
Tomoki Kobiki
Application Number:
JP2013088813A
Publication Date:
September 26, 2018
Filing Date:
April 03, 2013
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
C25D7/06; C25D1/04; H05K1/09; H05K3/38
Domestic Patent References:
| JP2012107266A | ||||
| JP4221092A | ||||
| JP2013001993A | ||||
| JP1194391A | ||||
| JP2012109526A | ||||
| JP2000309898A | ||||
| JP5175992B1 | ||||
| JP2010242129A | ||||
| JP4036489A | ||||
| JP2012022939A | ||||
| JP2002280689A |
Foreign References:
| WO2013031913A1 | ||||
| WO2012066991A1 | ||||
| US20120015206 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation