Title:
パッケージキャリアおよびその製造方法
Document Type and Number:
Japanese Patent JP6429343
Kind Code:
B2
Abstract:
A manufacturing method including following steps is provided. A substrate that includes a core layer, a first conductive layer, and a second conductive layer is provided. A heat conducting channel is formed in the substrate, and an adhesion layer is formed on the second conductive layer to cover a side of the heat conducting channel. A heat conducting element and a buffer layer are placed into the heat conducting channel, and a gap is formed between either the heat conducting element or the buffer layer and an inner side surface of the heat conducting channel. The gap is filled with a first insulant material, and the adhesion layer and the buffer layer are removed to form a cavity and expose the heat conducting element. The first conductive layer and the second conductive layer are patterned to form a first patterned circuit layer and a second patterned circuit layer, respectively.
Inventors:
Gold win
Zheng Zhi
Grandchild
Zheng Zhi
Grandchild
Application Number:
JP2017139685A
Publication Date:
November 28, 2018
Filing Date:
July 19, 2017
Export Citation:
Assignee:
Asahi Tohoku Technology Co., Ltd.
International Classes:
H01L23/12; H05K3/46
Domestic Patent References:
| JP2016025143A | ||||
| JP4124899A | ||||
| JP2016111319A |
Foreign References:
| US20030100197 |
Attorney, Agent or Firm:
Makoto Hagiwara
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