Title:
半導体装置
Document Type and Number:
Japanese Patent JP6488940
Kind Code:
B2
Abstract:
In a semiconductor device, a multilayer substrate includes an insulating substrate, a first circuit board having a first semiconductor chip disposed thereon, and a second circuit board having a second semiconductor chip disposed thereon. On the multilayer substrate of the semiconductor device, a plate portion of a resin plate including a first positioning portion that regulates the position of each semiconductor chip is sandwiched between a first jumper terminal, which includes a first terminal connected to the first semiconductor chip and a first plate member perpendicular to the first terminal, and a second jumper terminal, which includes a second terminal connected to the second semiconductor chip and a second plate member perpendicular to the second terminal.
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Inventors:
Soyano Shin
Application Number:
JP2015156632A
Publication Date:
March 27, 2019
Filing Date:
August 07, 2015
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H01L25/07; H01L21/60; H01L23/48; H01L25/18
Domestic Patent References:
| JP2008295227A | ||||
| JP201197053A | ||||
| JP2007042796A |
Foreign References:
| WO2009110376A1 |
Attorney, Agent or Firm:
Takeshi Hattori
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