Title:
パワー半導体モジュール
Document Type and Number:
Japanese Patent JP5469942
Kind Code:
B2
Abstract:
The power semiconductor module (10) has a substrate (12), housing (14) and a bridge element (16), where the substrate has a conductive strip (20) for load connection elements (38) and for power semiconductor elements. The conductive strip is provided at a main surface (18), and on opposite to another main surface (22). The substrate forms a component (26) with the bridge element, which is arranged in parallel lateral direction for both main surfaces of the substrate.
Inventors:
Liner pop
Marx Gruber
Marx Gruber
Application Number:
JP2009167694A
Publication Date:
April 16, 2014
Filing Date:
July 16, 2009
Export Citation:
Assignee:
SEMIKRON Elektronik GmbH & Co.KG
International Classes:
H01L25/18; H01L25/07
Domestic Patent References:
| JP5121605A | ||||
| JP6209073A | ||||
| JP2007221126A | ||||
| JP2007221128A | ||||
| JP2009147314A |
Foreign References:
| WO2004109801A1 |
Attorney, Agent or Firm:
Fujita Akira
Hideki Imai
Hideki Imai