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Title:
放熱部品及びその製造方法
Document Type and Number:
Japanese Patent JP6489979
Kind Code:
B2
Abstract:
A heat transfer device includes a base material and a composite plating layer formed on the base material, wherein the composite plating layer includes metal and graphene particles dispersed in the metal.

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Inventors:
Junyuki Suwa
Kenji Kawamura
Susumu Arai
Application Number:
JP2015175671A
Publication Date:
March 27, 2019
Filing Date:
September 07, 2015
Export Citation:
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Assignee:
Shinko Electric Industry Co., Ltd.
Shinshu University
International Classes:
C23C18/52
Domestic Patent References:
JP2001168249A
JP2013104111A
Foreign References:
CN104862676A
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito



 
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