Title:
基材の選択的な研磨用の湿式法セリア組成物および関連する方法
Document Type and Number:
Japanese Patent JP6553599
Kind Code:
B2
Abstract:
Disclosed are a chemical-mechanical polishing composition and a method of polishing a substrate. The polishing composition comprises wet-process ceria abrasive particles, (e.g., about 120 nm or less), at least one alcohol amine, at least one surfactant having at least one hydrophilic moiety and at least one hydrophobic moiety, the surfactant having a molecular weight of about 1000, and water, wherein the polishing composition has a pH of about 6. The polishing composition can be used, e.g., to polish any suitable substrate, such as a polysilicon wafer used in the semiconductor industry.
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Inventors:
Brian rice
Application Number:
JP2016521778A
Publication Date:
July 31, 2019
Filing Date:
September 30, 2014
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORPORATION
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
| JP2011530166A | ||||
| JP2008539581A | ||||
| JP2013140984A |
Foreign References:
| WO2013138558A1 | ||||
| US20080085602 | ||||
| WO2008032680A1 |
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mitsuhashi
Jun Tsuruta
Tomohiro Minamiyama
Yoichi Watanabe
Naori Kota
Kenji Kimura
Shinji Mitsuhashi
Jun Tsuruta
Tomohiro Minamiyama
Yoichi Watanabe
Naori Kota
Kenji Kimura