Title:
ヒートポンプシステム
Document Type and Number:
Japanese Patent JP6559339
Kind Code:
B2
Abstract:
A heat pump system of the present invention includes: a low temperature heating side refrigerant circuit; a high temperature heating side refrigerant circuit; a first pipe to connect a low temperature side liquid supply port, a low temperature heating side condenser, and a high temperature heating side evaporator in this order, thereby to circulate liquid; a second pipe configured to connect a high temperature side liquid supply port and a high temperature heating side condenser in this order, thereby to circulate the liquid; a pump provided in the first pipe and configured to feed the liquid heated in the low temperature heating side condenser to the high temperature heating side evaporator; a control valve provided in the first pipe between the low temperature heating side condenser and the high temperature heating side evaporator and configured to control a flow rate of the liquid circulated inside the first pipe; and a control unit configured to control at least one of the pump and the control valve, and control a flow rate of the liquid fed from the low temperature heating side condenser to the high temperature heating side evaporator.
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Inventors:
Kadowaki Hitoshi
Application Number:
JP2018516249A
Publication Date:
August 14, 2019
Filing Date:
May 10, 2016
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
F25B7/00; F25B1/00; F25B29/00
Domestic Patent References:
| JP2011257036A | ||||
| JP336467A | ||||
| JP1314864A | ||||
| JP2007232282A | ||||
| JP200617376A | ||||
| JP6038561A |
Foreign References:
| WO2010013590A1 |
Attorney, Agent or Firm:
Patent Business Corporation Kisa Patent Trademark Office