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Title:
熱硬化性樹脂組成物、これを用いたプリプレグ、樹脂付フィルム、積層板、プリント配線板及び半導体パッケージ
Document Type and Number:
Japanese Patent JP6597721
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that satisfactorily exhibits a low curing shrinkage, a low thermal expansion, excellent dielectric properties, and a high elastic modulus, and a prepreg, a film with resin, a laminate, a printed wiring board and a semiconductor package prepared therewith.SOLUTION: A thermosetting resin composition contains an aromatic azomethine compound (A) having at least one aldehyde group in one molecule, a siloxane compound (B) having a primary amino group, and a maleimide compound (C) having an N-substituted maleimide group. There are also provided a prepreg, a film with resin, a laminate, a printed wiring board and a semiconductor package prepared therewith.SELECTED DRAWING: None

Inventors:
小竹 智彦
長井 駿介
橋本 慎太郎
安部 慎一郎
宮武 正人
高根沢 伸
村井 曜
Application Number:
JP2017126474A
Publication Date:
October 30, 2019
Filing Date:
June 28, 2017
Export Citation:
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Assignee:
日立化成株式会社
International Classes:
C08J5/24; C08G12/40; C08G73/00; C08K3/00; C08L79/00; C08L101/02; H05K1/03
Domestic Patent References:
JP2005148112A
JP2015086253A
JP2012001486A
Foreign References:
WO2012099132A1
Attorney, Agent or Firm:
大谷 保



 
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