Title:
液浸冷却用電子機器、及び電源ユニット、並びに冷却システム
Document Type and Number:
Japanese Patent JP6644906
Kind Code:
B2
Abstract:
Provided is an electronic device that is immersed in a coolant inside a cooling device and directly cooled. The electronic device includes: a carrier substrate comprising a voltage input terminal that supplies DC voltage for the electronic device; and a supporting member that supports the carrier substrate. The voltage input terminal is electrically connected to a voltage output terminal in a power supply unit. The supporting member supports the carrier substrate so as to be positioned in an upper section of the power supply unit arranged in the bottom section of a cooling tank provided in the cooling device, when the electronic device is electrically connected to the power supply unit. The supporting member can include a backboard or a frame structure that have the carrier substrate fixed to one surface thereof. The backboard or frame structure can be slidably supported by a plurality of support columns vertically erected and fixed inside the cooling tank. The backboard or frame structure can include a support pin or guide pin inserted, from above, into a bracket fixed inside the cooling tank.
Inventors:
Motoaki Saito
Application Number:
JP2018549728A
Publication Date:
February 12, 2020
Filing Date:
November 12, 2016
Export Citation:
Assignee:
Exascaler Co., Ltd.
International Classes:
H05K7/20; G06F1/20; H05K7/14
Domestic Patent References:
| JP5090146U | ||||
| JP2009537905A | ||||
| JP6169039A | ||||
| JP2017163065A |
Foreign References:
| WO2016117098A1 |
Attorney, Agent or Firm:
Kenji Kuroda
Takashi Matsumoto
Takashi Matsumoto