Title:
液浸冷却用電子機器、及び電源ユニット、並びに冷却システム
Document Type and Number:
Japanese Patent JP6644907
Kind Code:
B2
Abstract:
Provided are an electronic device and a power supply unit, both of which are immersed and directly cooled in a coolant filled in a cooling apparatus. The electronic device includes a carrier substrate having a voltage input terminal for supplying a DC voltage for the electronic device, a plurality of module connectors arranged on one surface of the carrier substrate, a plurality of module substrates, a plurality of supporting plates for holding both ends of the respective module substrates, and a supporting member for supporting the carrier substrate. The voltage input terminal is electrically connected to a voltage output terminal of the power supply unit. Each of the module substrates includes a module connector plug electrically coupled to each of the module connectors. The supporting member supports the carrier substrate so as to be positioned at the upper part of the power supply unit mounted on the bottom of the cooling tank of the cooling apparatus upon electrical connection between the electronic device and the power supply unit. The power supply unit includes a unit substrate, a voltage step-down device mounted on the unit substrate, and a stage to which the unit substrate is fixed.
Inventors:
Motoaki Saito
Application Number:
JP2018549729A
Publication Date:
February 12, 2020
Filing Date:
November 12, 2016
Export Citation:
Assignee:
Exascaler Co., Ltd.
International Classes:
H05K7/20; G06F1/20; H05K7/14
Domestic Patent References:
| JP5090146U | ||||
| JP2009537905A | ||||
| JP6169039A | ||||
| JP2017163065A |
Foreign References:
| WO2016117098A1 |
Attorney, Agent or Firm:
Kenji Kuroda
Takashi Matsumoto
Takashi Matsumoto