Title:
ワイヤクランプ装置のキャリブレーション方法及びワイヤボンディング装置
Document Type and Number:
Japanese Patent JP6654304
Kind Code:
B2
Abstract:
This wire clamp apparatus calibration method comprises: a step for driving a driving piezoelectric element by applying a predetermined frequency that causes a pair of arm portions to vibrate in an opening/closing direction; a step for detecting whether or not end portions of the pair of arm portions collide with each other on the basis of an output current outputted from the driving piezoelectric element when the pair of arm portions are vibrating in the opening/closing direction; a step for calculating, on the basis of the detection result, reference voltages in a state where the pair of arm portions are closed; and a step for performing calibration of a drive voltage to be applied to the driving piezoelectric element on the basis of the reference voltages. Accordingly, accuracy improvement and stabilization in an opening/closing operation of the wire clamp apparatus can be achieved.
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Inventors:
Youhei Uchida
Naoya Hira
Naoya Hira
Application Number:
JP2018535722A
Publication Date:
February 26, 2020
Filing Date:
August 23, 2017
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
H01L21/60
Domestic Patent References:
| JP6260523A | ||||
| JP6260524A | ||||
| JP5259213A | ||||
| JP63111634A | ||||
| JP9162228A |
Foreign References:
| WO2015122410A1 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito